Reverse engineering (or copy), is a technology process. Stems from its commercial and military  hardware in the field of analysis.

Its main purpose is to reverse a project product analysis and research, and then come to the product processing, group Organizational structure, functional performance specifications, etc., to produce the same product.

1. Improve inadequate or lack of archives left behind, to complete the relevant information retained in order to facilitate subsequent analysis and tracking improvement.

2. When using the facilities and equipment on demand to extend the number of years of life extension program, not because of the original product can no longer provide maintenance shutdown caused Repair and spare parts. (By the original manufacturer or restricted to high prices, and asked to update threat products)

3. Can be improved to obtain a high rate and spare proper rate, reduce risk and cost. (Especially in power plants and military market is booming demand)

1. Disassemble: Photographic object diagram→Doffing element→(elements of search and inquiry and confirm the replacement materials and parts)→Element classification→Establish the BOM→(and confirm the purchase and delivery of components)

2. Slip PCB:  Job sectional layer by layer→Layer by layer scan job→(computer drawing circuit diagram and a circuit diagram of transfer)

3. CAM & AW: turn out Gerber File→(and to develop process conditions)→Typesetting system before the job  (the aperture hole table and forming FIG)→Line drawing sheet layers→(the text part and negatives)

4. PCB PM: System data before confirmation→Sends the material samples Process→Sample comparison confirmed→Board member Zhengshiliangchan

5. SMT / DIP: BOM table to verify→(check the feed)→The sample pieces of work→Found sample confirmed→Official production operations→Environmental testing and certification→(according to customer needs)→Coat the job→(no seismic demand)

6. ASSY / TEST: plastic / mechanism assembly→(environmental testing and certification)  

　　　　　　↓                                      (according to customer demand shock)

QC job control Inspection Coat

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QC Shipping Report

1. Lead time: first from the client to obtain physical samples, the degree of difficulty to obtain  confirmation element and the length of time delivery, and assessment and complete the BOM for a period of three weeks whether the burning program - four weeks.

2. The sectional plates to Gerber File from about 3 to 10 days.

3. PCB bare board layers may be completed by 7 days to 18 days.

4. SMT & Assemble & Coat of about 5 days to 10 days.

5. According to customer requirements to do environmental testing and certification, in order to determine the size and the number of days at least 4 days.

6. The following stages will have to be backed up archive retained on file:

Line (wiring) diagram, schematics, BOM table, substitute materials and parts information, related product material documents, shipment inspection documents, Gerber File and so on.

7. If you increase or decrease in customer demand for functional modifications, and customers will discuss a feasibility assist in line with amendments made to it.

8. Our company’s equipment are introduce from foreign technology research and development equipment, special agent for stripping layers, layer scanning surface continuity to complete the job. And then converted into a drawing layer than the latter to be converted into the relevant drawing complete archive!

9. The company's ability to reverse up to 16-layer circuit board, there are three decades of cooperation in the energy maintenance circuit boards concerted efforts, with other nature-related industry can not be compared!